Analysis equipment
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![]() ASAP-1® IPS Digital Selected Area Preparation System |
ASAP-1® IPS Description ㆍEnhanced processing for backside analysis, decapsulation, Precision machining and parallel polishing ㆍReal-Time Video Monitor with system parameters – ’ALWAYS LIVE’ ㆍLarge 100mm x 100mmm preparation area ㆍPatented ULTRACOLLIMATOR Mode for sub-micron alignment of topside dice, etc. ㆍTouch-screen control with physical joystick & Controls. ㆍX, Y and Z axes all have industry-leading deep sub-micron accuracy Vacuum removal of particles available as an option ㆍPatented Floating Head provides a true polishing action - Enhanced with Force Feedback ㆍAdds sample curvature definition – Suits decapsulation, thinning, and polishing of packaged dice showing warpage or non-flat conditions. ㆍIndependent X & Y Axis Correction, AUTOCURVE Mode. ㆍAlso adds Stage AUTOTILT function |
![]() Radiant Laser Etch2 Laser Decapsulation |
Radiant Laser Etch2 Description * Intuitive * Easy to learn & Use * Start Decaping immediately * Amazing soultions * No Damage Wires * On Copper, Gold, Silver/Gold wires * High Laser Safety Features |