ASAP-1® IPS

Description

ㆍEnhanced processing for backside analysis, decapsulation, Precision
   machining and parallel polishing
ㆍReal-Time Video Monitor with system parameters –  ’ALWAYS LIVE’
ㆍLarge 100mm x 100mmm preparation area
ㆍPatented ULTRACOLLIMATOR Mode for sub-micron alignment of 
   topside dice, etc.
ㆍTouch-screen control with physical joystick & Controls.
ㆍX, Y and Z axes all have industry-leading deep sub-micron accuracy
   Vacuum removal of particles available as an option
ㆍPatented Floating Head provides a true polishing action - Enhanced
   with Force Feedback
ㆍAdds sample curvature definition – Suits decapsulation, thinning, 
   and polishing of packaged dice showing warpage or 
   non-flat conditions. 
ㆍIndependent X & Y Axis Correction, AUTOCURVE Mode.  
ㆍAlso adds Stage AUTOTILT function

Radiant Laser Etch2

Description

* Intuitive
* Easy to learn & Use
* Start Decaping immediately
* Amazing soultions
* No Damage Wires
* On Copper, Gold, Silver/Gold wires
* High Laser Safety Features