Intergrated System : ASAP-1 IPS + F3
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작성자 최고관리자 댓글 0건 조회 2,668회 작성일 19-06-25 14:30본문
| ASAP-1 IPS + F3 Through-Silicon Measurement System |
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Fully integrated system approach to Silicon Thinning & Metrology
Shown in the image is a small-footprint, fully integrated lab that provides decapsulation, thinning and polishing possibilities, with the inclusion of thermal, contouring and End-point techniques for tackling the most challenging of applications.
The Filmetrics F3 through-thickness metrology systems, in conjunction with ASAP-1 IPS and the REALTIME PEEC module allows RST measurement from full wafer thickness, down to sub-micron thin films.
Ask ULTRA TEC today about how our through-silicon measurement solutions can improve your backside prep results.
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